Microelectronic Packaging (New Trends in Electrochemical Technology)
by M. Datta, Tetsuya Osaka, J. Walter Schultze, Darrel Richard Frear, Paul A. Kohl, Sol Krongelb, Yutaka Okinaka, David Kwesi Watts, Haruo Akahoshi, Jeffery W. Butterbaugh, Valery M. Dubin, Kazuhiro Ikuina, Saikumar Jayaraman, Tom Ritzdorf, Yosi Shacham-Diamand, Shinichi Wakabayashi, Osamu Yoshioka, Manabu Tsujimura, Norio Kimura, Sergey Lopatin, William Hines Lytle, Thomas Marieb, Nicolai Petrov, Lubomyr T. Romankiw, Vadim Bogush, Akira Chinda, Nathan Croitoru, Moshe Eizenberg, Alexandra Inberg,
Microelectronic Packaging (New Trends in Electrochemical Technology)
by M. Datta, Tetsuya Osaka, J. Walter Schultze, Darrel Richard Frear, Paul A. Kohl, Sol Krongelb, Yutaka Okinaka, David Kwesi Watts, Haruo Akahoshi, Jeffery W. Butterbaugh, Valery M. Dubin, Kazuhiro Ikuina, Saikumar Jayaraman, Tom Ritzdorf, Yosi Shacham-Diamand, Shinichi Wakabayashi, Osamu Yoshioka, Manabu Tsujimura, Norio Kimura, Sergey Lopatin, William Hines Lytle, Thomas Marieb, Nicolai Petrov, Lubomyr T. Romankiw, Vadim Bogush, Akira Chinda, Nathan Croitoru, Moshe Eizenberg, Alexandra Inberg,
ISBN 13: 9780415311908
Format: Hardcover
(568 pages)
Publisher: CRC Press
Published: 20 Dec 2004
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